The use of Heat Shrinkable Braided Sleeve in the electronics industry

In the field of electronics and electrical appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are developing in the direction of being light, thin, and small, and the heat generation is also increasing. Therefore, high thermal conductivity insulation materials are needed to effectively remove electronic equipment. The amount of heat generated is related to the service life and quality reliability of the product. The traditional way to deal with the heat dissipation of electronic equipment is to put a layer of insulating medium between the heating element and the heat sink as a Special Material Braided Sleeve, such as mica, polytetrafluoroethylene, beryllium oxide ceramics, etc. This method has a certain effect, but there are defects such as poor thermal conductivity, low mechanical performance, and high price.

At present, some of the heat dissipation of electronic equipment is handled by various forms of radiators, but most of them need to be handled by Special Material Braided Sleeve. Heat Shrinkable Braided Sleeve are the most important member of Special Material Braided Sleeve. This article will focus on the use of thermal paste and Heat Shrinkable Braided Sleeve to provide heat conduction solutions for electronic equipment.
Thermal conductive silicone rubber material is a typical polymer composite material. Its thermal conductivity performance is mainly determined by the type of thermal conductive filler and the distribution of thermal conductive filler in the silicone rubber matrix. Thermal conductive filler is divided into metal fillers and inorganic non-metallic fillers. The thermal conductivity mechanisms of various fillers are different, which determines the difference in thermal conductivity or thermal conductivity. Thermal conductive paste is a mechanically mixed paste of silicone oil and thermal conductive filler. It has the characteristics of being ready to shape, high thermal conductivity, non-curing, and non-corrosive to interface materials. In electronic equipment, there are many contact surfaces and mounting surfaces between various electronic components. There are gaps between them, resulting in poor heat flow. In order to solve this problem, thermal paste is usually filled between the contact surfaces. Using thermal paste Move to remove the air between interfaces and reduce or even eliminate thermal resistance.
Heat Shrinkable Braided Sleeve are Heat Shrinkable Braided Sleeve processed through a special production process. They have the characteristics of natural viscosity, high thermal conductivity, high compression resistance, high cushioning, etc. They are mainly used in heating equipment, heat sinks and machines. The gap-filling material of the shell, due to its softness and elasticity under low pressure, can be in close contact with the surface of the device or even rough surface structures, reducing the thermal resistance of the air, and excellently solves the problem of thermally conductive silicone paste after high temperatures. There are defects such as silicone oil leakage and dust accumulation on the surface.